BOTH PARTIES SEEK TO COOPERATE IN THE DEVELOPMENT OF NEW TECHNOLOGY IN IC SUBSTRATE, ADVANCED PACKAGING AND TALENT POOL.
KUALA LUMPUR, Malaysia, Oct 17 (Bernama) -- The Prime Minister of Malaysia, YAB Dato‘ Sri Ismail Sabri bin Yaakob, witnessed the exchange of Memorandum of Understanding (MOU) between AT&S Austria Technologie & Systemtechnik (Malaysia) Sdn Bhd (AT&S Malaysia), represented by the Managing Director, Mr Vittorio Villari, and MIMOS Berhad (MIMOS), represented by the President and CEO, Dr. Iskandar Samad, for the joint development of R&D activities. The MOU Exchange Ceremony between AT&S Malaysia and MIMOS was also graced by the Minister of Science, Technology and Innovation, YB Dato’ Sri Dr. Adham bin Baba.
With the signing and exchange of MOU with MIMOS, AT&S Malaysia is honoured and look forward to contribute to the microelectronics and technology fields in Malaysia. Specifically, AT&S Malaysia and MIMOS seek to carry out joint IC substrate research and development activities that would potentially engage the Ministry of Science, Technology and Innovation (MOSTI) and Ministry of Higher Education (MOHE).
In addition, both parties have expressed interest to cooperate in technology assessment and development in the area of advanced packaging in order to strengthen the local industry capabilities, together with a focus to help develop critical talents in advanced packaging through MOSTI Deeptech and Futureskills initiative. Potentially, the establishment of an institute with a selected University in Malaysia is considered in the joint pursuit for the purpose of talent development.
“The Covid-19 Pandemic has fueled the speed of digitalization as it has changed the way businesses are run and how we live our life.”, says AT&S Managing Director, Mr Vittorio Villari. “The rapid emergence and application of artificial intelligence, Internet of Things and Big Data have created a radical shift in global demand for microelectronics products such as our high-end IC Substrates. They are widely used in high-performance computers, server, cloud, edge computing and many more. As such, we believe that our know-how and presence here would help to raise the global competitiveness of Malaysia in IC Substrates field. Now, through the cooperation with MIMOS, we hope to further accelerate the advancement of technology solutions to benefit the societies’ greatest needs.”
Dr Iskandar Samad, the President and CEO of MIMOS, commented, “Our collaboration with AT&S supports the nation’s renewed aspiration for a more technologically driven future for the domestic E&E sector, as underpinned by MOSTI’s E&E Roadmap launched in August this year. Malaysia needs more higher value-added activities to strengthen its domestic eco-system, and targeted collaborations with leading global players like AT&S who have established strength in IC substrates and advanced packaging will be key to unlock new opportunities for the country, be it in developing local industry or producing more high-skilled talent. This initiative also reinforces our new branding, MIMOS Global, that underscores a more international approach to partnerships and technology co-development with established market players.”
SOURCE: AT&S Austria Technologie & Systemtechnik (Malaysia) Sdn BhdFOR MORE INFORMATION, PLEASE CONTACT: Name: Ms. Ruth Foo
Corporate Affairs & Communications Manager
AT&S Austria Technologie & Systemtechnik (Malaysia) Sdn Bhd
Tel: +6012 8922883
Email: ruth.foo@my.ats.net
Namer: Mr. Gerald Reischl
Director Communications & PR
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Tel: +43 664 88592452
Email: g.reischl@ats.net
--BERNAMA 
