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August 27, 2024 -Tuesday

 
  AT&S MALAYSIA WELCOMES MITI MINISTER TO KULIM CAMPUS

Thursday 22/08/2024



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AT&S Malaysia welcomes MITI Minister, Tengku Datuk Seri Utama Zafrul Tengku Abdul Aziz to Kulim Campus


KULIM, Aug 22 (Bernama) -- For the first time, AT&S Malaysia was honored to host the Minister of Investment, Trade and Industry (MITI), Tengku Datuk Seri Utama Zafrul Tengku Abdul Aziz, and the Chief Executive Officer of Malaysian Investment Development Authority (MIDA), Sikh Shamsul Ibrahim Sikh Abdul Majid. They were hospitably taken for a tour at AT&S’s first state-of-the-art manufacturing facility in Southeast Asia, located in Kulim Hi-Tech Park.

The delegation of 30 members was received by AT&S Executive Vice President of Business Unit Microelectronics and a Member of Board, Ingolf Schroeder, AT&S Senior Vice President and Malaysia Managing Director, ChenJiang Phua, and Senior Vice President of Operations, Joseph Paton Ireland, at the seven-storey Administrative Building.

MITI Minister Tengku Zafrul said after witnessing the scale of the first high-end IC substrate plant in Malaysia: “We welcome AT&S’s continued trust in our clear industrial policies. We share AT&S’s pride in introducing the unprecedented, highly advanced and sophisticated substrate technology to Malaysia. I am confident the transfer of technology will have a positive economic spillover for both our local talents and SMEs, as they help shape Malaysia into a ‘Silicon Valley of Microelectronics in the East’”.

CEO of MIDA, Sikh Shamsul, remarked: “It's incredible to see how far AT&S has come in just three years. From a groundbreaking ceremony to this cutting-edge manufacturing facility, they will be creating more than 3,000 high-skilled jobs for Phase 1. It's a testament to their hard work and dedication. MIDA is all in on facilitating AT&S as they kick things off and continue to make a big impact in Malaysia.”

In welcoming the honorable guests, Schroeder said: “The first courtesy visit of MITI Minister and MIDA CEO to the first high-end IC substrate manufacturing facility in Malaysia marks a historic chapter for Malaysia, MITI and AT&S. The visit further underscores our mutual commitment to enhance the competitiveness of Malaysian E&E sector, develop local talent for the leading-edge industry, and build local supply chain to support the growth of Malaysian economy.”

Phua added: “AT&S Malaysia has been well supported by MITI and MIDA since project inception until completion. They play a critical facilitating role between us and the approving authorities that helps us navigate our operation in a new country. We will keep a close collaboration with MITI and MIDA for our next chapter – the production of sophisticated IC substrates for high performance AMD data center processors and accelerators.”

The newest production plant of AT&S in Kulim is equipped with cutting-edge facilities and was built according to the highest standards of quality, recycling systems and sustainability. It is now gearing towards high volume manufacturing by end of fiscal year 2024/25.

SOURCE : Junzi Communications 

FOR MORE INFORMATION, PLEASE CONTACT:
Name: Gerald Reischl
Vice President Corporate Communications
Tel: +43 3842 200 4252 / +43 664 8859 2452
Email: g.reischl@ats.net
 
Name: Ruth Foo
Senior Corporate Affairs & Communications Manager, Malaysia
Tel: +6012 8922883
Email: ruth.foo@my.ats.net 

--BERNAMA

 
 
 

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